English
IPC-7095 governs BGA design, placement, reflow profiling, void criteria, and X-ray inspection. Superb Automation achieves sub-5% BGA void rates — well below the IPC Class 3 requirement of under 30%.
AOI sees what the eye can see — and does it thousands of times per minute with machine consistency. X-ray sees what AOI cannot: the solder joints hidden beneath BGA, QFN, and CSP packages. This article compares both methods, explains when each is suf